Metallic Vapour Deposition Printing of Circuits

Let me start from the origin of this idea. I got this idea while having lunch at the Limbdi Hostel mess of IT-BHU. I had read about Intel making new 3-D chips but I couldn't figure out how exactly would they achieve the fabrication of the three dimensional structures. Then I had an idea of depositing atoms one by one to make larger structures. But the major problem to achieve this capability would be to control the individual atoms. How could you get metallic circuit elements to deposit on the chip OUT OF THIN AIR and bang, the idea to use lasers to deposit metallic vapour popped up in my mind!. My core idea was to use the reactions named Monds process and Van Arkel process to deposit metal on the silicon substrate. In these processes the metallic vapour compound decomposes by heating, giving pure metal which would deposit on the surface of the silicon substrate. Heating is achieved by using focused lasers which heats the metallic vapour in an extremely small region. Hence we get metallic contacts on a integrated circuit. The amazing thing with this technique is that this can be used to make nano-scale circuits efficiently.
I have attached my 3 page paper which I presented in a paper presentation competition of Electrical Engg Department, IT-BHU. I expect some peer review and inputs on this idea.
Research paper - Laser fabrication of circuits